Taiwanese Semi-Conductor manufacturer MediaTek has today unveiled the one of the most powerful SoC, Helio X30 which can compete with the Qualcomm’s Snapdragon 820. The Helio X30 is the powerful successor of Helio X20/X25 which has launched last year with world’s first deca-core tri cluster technology. Helio X30 also uses the same structure, of deca-core and tri-cluster. The chipset is built using the TSMC 10nm FinFET process, as its predecessors Helio X20 and X25 used 20nm process.
MediaTek Helio X30 Chipset carries 10 cores, and four of them are Cortex A73 clocked at 2.8GHz, four Cortex A53 cores at 2.2GHz, and remaining two cores of Cortex A35 are at 2GHz. The Chipset has a powerful PowerVR 7XT quad-core GPU, mainly focused on VR based rendering and gaming. It supports LPDDR4 RA upto 8GB, with UFS 2.1 Standard for native storage. It supports the Camera module sensors upto 26MP, with dual-camera support.
The modem which is moulded with Helio X30 supports Three Carrier Aggregation, aka 3CA which enables three bands combination and also supports LTE Cat.12. The Chipset is expected to come along with some upcoming flagship devices on Asian continent, especially in China.