Huawei’s very own in-house HiSilicon Kirin System on Chips (SoC) are made very powerful enough to compete with generally made flagship killers on the market from manufacturers like Qualcomm and Mediatek. The nomenclature processes upon Kirin processors have reached the number 960 by the launch of Kirin 960 Chipset last month, integrated with Huawei Mate 9.
After making smartphones with Kirin 950, Huawei launched an upgraded version of 950 named Kirin 955 with a slight improvement in performance scoresheet. All these three chips, Kirin 950, 955 and 960 are made using the 16nm FinFET process. Now, the next generation power player in Kirin series, the Kirin 970 is reported to come with 8-cores, and manufactured with better 10nm FinFET process, better than before. Well, Qualcomm also started making Snapdragon 835 with the same 10nm process, and also Samsung on Exynos 8895. Using 10nm process in manufacturing, the semiconductor can carry 30% more transistors, compared to 14nm process – Moore’s law comes true.
Information regarding the alleged Kirin 970 has not been verified yet, and this is just a rumored report. But it seems like Huawei will announce some info about their next SoC, as the others have already done.