Chinese OEM giant Huawei has been working on their next flagship smartphone device is Mate lineup, Mate 10 after the launch of Mate 9 in last year. The phablet series devices are so well equipped and powerful enough to be considered as a better competent to other flagships in Maret from other rivals like Samsung and LG. It is not surprising that the Huawei has already been into the dual camera configuration in all of their flagship series devices, including the ones from the sub-brand Honor. Mate series too have gotten the dual camera features from the preceding Mate 9 and Mate Pro devices by last year. Now, several rumors claim that the Chinese giant is currently working on a new chipset to be equipped and unveiled with the Mate 10 smartphones by later this year.
According to Pang Jiutang, a technical analyst, the Huawei is supposedly working on the Kirin 970 10nm Chipset, where its rivals in Chipset manufacturing like Qualcomm and Samsung Exynos have already had their own, in order to get sustained in the market with better power efficiency and output, Huawei’s HiSilicon will surely use a 10-nanometer technology to develop their next flagship level chipset with possibly old Cortex A-73, instead of new Cortex A-75 architecture. There is no clear point stated regarding the usage of same old A-73 architecture, perhaps because of the lack of time and resources to mass produce.
Huawei Mate 10 is expected to hit the market by October or November, with op tier specs from the company. The smartphone is supposed to have a bezel-less design with a 3D design possibly, more like Galaxy S8 it seems. No other specs av been confirmed yet; we could expect a dual camera and at least 6gigs of RAM under the hood.